Now On Demand
Brought to you by:
DuPont Electronics & Communications
Webinar Overview:
High Speed? High frequency? And flexibility? Now you can have it all.
Why should flexibility limit speed? Why must high frequency require glass-reinforced rigidity? Why should designers and fabricators have to choose between two essentials?
The circuit designs of the future move beyond these limitations to embrace a new possibility to provide flexibility without signal loss, and strength without sluggishness. DuPont™ Pyralux® TK flexible circuit material creates this new reality, merging flexibility with high speed.
As a new flex laminate, Pyralux® TK is designed for flexible applications and high speed. It is a composite of two proven products: DuPont™ Teflon® fluoropolymer film and DuPont™ Kapton® polyimide film. Teflon® film supplies a lower DK, enabling thinner dielectrics, as well as wider lines for the same impedance target. In addition, Teflon® works as an adhesive to reduce Df for higher speed and less signal loss. Using Kapton® for the core provides the mechanical and flexible circuit properties needed for flex circuit applications.
Discussion will include:
Convergence of flex and high speed
Microstrip and stripline-controlled impedance constructions
Impedance measurements
Signal loss analysis
Digital signal analysis
Who Should Attend this Webinar:
- Circuit board designers and fabricators
- Engineering managers
- Project engineers and managers
Presented by:
Glenn Oliver, Senior Engineer, - High Frequency / High Speed Applications, DuPont Electronics and Communications
Glenn Oliver is a senior engineer with DuPont Electronics and Communications. He received his BS in physics and his master’s in engineering from North Carolina State University. His work background includes eight years in photonics research and development, followed by seven years in RF/microwave development and applications. He is currently the principal engineer responsible for characterization of electrical properties of materials for high-frequency applications. His other areas of focus are high-speed flexible circuitry interconnect and high-density interconnection applications support.
Webinars Produced By: UP Media Group, Inc.
